Did you mean: MSC11P0650
Product Datasheet Search Results:
4 Pages, 314 KB, Original- AMD PACKAGES AND PACKING
- Advanced Micro Devices
- Board Assembly
10 Pages, 1485 KB, Original- PACKAGES AND PACKING
- Advanced Micro Devices
- Die and Wafer Shipments
19 Pages, 236 KB, Original- PACKING CONSIDERATIONS METHODS MATERIALS AND REC
- National Semiconductor
- Packing Considerations(Methods, Materials and Recycling)
16 Pages, 127 KB, Original- SC01 PACKING 1996 1
- Philips Semiconductors / Nxp Semiconductors
- PACKING AND PACKING QUANTITIES
2 Pages, 7 KB, Original- SC10 PACKING
- Philips Semiconductors / Nxp Semiconductors
- Small-signal Transistors and Diodes Packing Quantities
6 Pages, 79 KB, Original- SC11 PACKING
- Philips Semiconductors / Nxp Semiconductors
- Package Overview
11 Pages, 75 KB, Original- SC13 PACKING
- Philips Semiconductors / Nxp Semiconductors
- PACKING AND PACKING QUANTITIES
12 Pages, 79 KB, Original- SC13 PACKING 98 1
- Philips Semiconductors / Nxp Semiconductors
- Packing and packing quantities PowerMOS transistors
Product Details Search Results:
Amphenol.com/D38999/24SC11PN
{"Family":"D38999","Gender":"RCP","Body Orientation":"Straight","Contact Gender":"PIN","Product Length (mm)":"31.9(mm)","Mounting Style":"Jam Nut","Number of Ports":"1(Port)","Rad Hardened":"No","Product Depth (mm)":"34.93(mm)","Product Diameter (mm)":"38.38(mm)","Contact Plating":"Gold Over Nickel","Termination Method":"Crimp","Operating Temp Range":"-65C to 200C","Shell Size / Insert Arrangement":"13-11","Strain Relief":"No","Type":"Circular","Product Height (mm)":"34.93(mm)","Shell Plating":"Nickel","Con...
1596 Bytes - 15:31:56, 16 November 2024
Methode.com/MSC11P0650
{"Status":"ACTIVE","Operating Frequency-Max":"10 GHz","Coupling Type":"THREADED","Manufacturer Series":"SMC","Contact Material":"NOT SPECIFIED","Connector Style":"STRAIGHT","Terminates To":"CABLE","Characteristic Impedance":"50 ohm","Dielectric Material":"POLYPROPYLENE","Connection Type":"SMC CONNECTOR"}...
1022 Bytes - 15:31:56, 16 November 2024
Methode.com/MSC11P1350
{"Status":"ACTIVE","Operating Frequency-Max":"10 GHz","Panel Mount":"Yes","Coupling Type":"THREADED","Manufacturer Series":"SMC","Contact Material":"NOT SPECIFIED","Connector Style":"STRAIGHT","Characteristic Impedance":"50 ohm","Dielectric Material":"POLYPROPYLENE","Connection Type":"SMC CONNECTOR"}...
1013 Bytes - 15:31:56, 16 November 2024
Documentation and Support
Use our online request for specific proposed solutions or send your technical question directly to a product specialist at request:
| File Name | File Size (MB) | Document | MOQ | Support |
|---|---|---|---|---|
| UNPACKING_AND_HANDLING_E1_2.pdf | 0.74 | 1 | Request | |
| MATERIAL_SAFETY_DATA_SHEET_FOR_WET_SOL_PLUS_UPPER_PACKING_LUBRICANT.pdf | 0.07 | 1 | Request | |
| EASY_PDU_NETWORK_MANAGEMENT_CARD_3_KIT_EP9640NMC3_UNPACKING_TME35657.pdf | 0.08 | 1 | Request | |
| NETSHELTER_UPS_DEPTH_WALL_MOUNT_ENCLOSURES_GUIDE_FOR_RECEIVING_AND_UNPACKING_990_900014_BW.pdf | 2.07 | 1 | Request | |
| ECOSTRUXURE_MICRO_DATA_CENTER_R_SERIES_MDC15UR500ACI_UNPACKING_SHEET_TME14047.pdf | 0.71 | 1 | Request | |
| ECOSTRUXURE_MICRO_DATA_CENTER_R_SERIES_MDC42UR2KACI_IN_MDC24UR1KACI_IN_MDC24UR500ACI_IN_UNPACKING_TME18017B.pdf | 0.73 | 1 | Request | |
| TME18018B_ECOSTRUXURE_MICRO_DATA_CENTER_R_SERIES_MDC15UR500ACI_IN_UNPACKING_SHEET.pdf | 0.58 | 1 | Request | |
| ECOSTRUXURE_MICRO_DATA_CENTER_R_SERIES_MDC42UR2KACI_MDC24UR1KACI_MDC24UR500ACI_UNPACKING_SHEET_TME13305.pdf | 0.77 | 1 | Request | |
| NETSHELTER_SX_CABINET_2ND_GENERATION_UNPACKING_SHEET_TME19836_ML.pdf | 2.39 | 1 | Request |
