Product Datasheet Search Results:
82 Pages, 940 KB, Original- W25Q64DWSSIP
- Winbond Electronics Corporation America
- 256K X 32 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
Product Details Search Results:
Winbond.com/W25Q64DWSSIP
{"Terminal Pitch":"1.27 mm","Terminal Form":"GULL WING","Operating Temperature-Max":"85 Cel","Clock Frequency-Max (fclk)":"104 MHz","Number of Words Code":"256K","Supply Voltage-Nom (Vsup)":"1.8 V","Temperature Grade":"INDUSTRIAL","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"-40 Cel","Number of Words":"262144 words","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"1","Access Time-Max (tACC)":"7.5 ns","Memory Density":"8.39E6 deg","Supply Voltage-Max (Vsup)":"1.9...
1610 Bytes - 15:18:43, 17 November 2024
Documentation and Support
Use our online request for specific proposed solutions or send your technical question directly to a product specialist at request:
| File Name | File Size (MB) | Document | MOQ | Support |
|---|---|---|---|---|
| BLACKBURN_STATIC_DISSIPATION_BONDING_KIT.pdf | 0.14 | 1 | Request |
