9-1437535-4 CONN IC DIP SOCKET 14POS GOLD
From TE Connectivity AMP Connectors
| Category | Connectors, Interconnects |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 25µin (0.63µm) |
| Contact Finish Thickness - Post | 25µin (0.63µm) |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Contact Resistance | 10 mOhm |
| Current Rating | - |
| Datasheets | 500 Series |
| Family | Sockets for ICs, Transistors |
| Features | Closed Frame |
| Housing Material | - |
| Material Flammability Rating | - |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 14 (2 x 7) |
| Operating Temperature | -55°C ~ 125°C |
| Other Names | 514-AG11D-ESL |
| Packaging | Tube |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Series | 500 |
| Standard Package | 1,360 |
| Termination | Solder |
| Termination Post Length | 0.125" (3.18mm) |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
