808-AG11D-ESL-LF CONN IC DIP SOCKET 8POS GOLD
From TE Connectivity AMP Connectors
| 3D Model | 2-1571552-2.pdf |
| Category | Connectors, Interconnects |
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | Flash |
| Contact Finish Thickness - Post | Flash |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Copper |
| Contact Resistance | 10 mOhm |
| Current Rating | - |
| Datasheets | 1571552 Drawing |
| Family | Sockets for ICs, Transistors |
| Features | Open Frame |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Online Catalog | 800 Series |
| Operating Temperature | -55°C ~ 105°C |
| Other Names | 2-1571552-2 2-1571552-2-ND A121607 |
| Packaging | Tube |
| Pitch - Mating | 0.100" (2.54mm) |
| Pitch - Post | 0.100" (2.54mm) |
| Product Photos | 808-AG11D-ESL-LF |
| RoHS Information | 2-1571552-2 Statement of Compliance RoHS 2 Statement |
| Series | 800 |
| Standard Package | 60 |
| Termination | Solder |
| Termination Post Length | 0.125" (3.18mm) |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
