1-1825093-4 CONN IC DIP SOCKET 16POS GOLD
From TE Connectivity AMP Connectors
3D Model | 1-1825093-4.pdf |
Category | Connectors, Interconnects |
Contact Finish - Mating | Gold |
Contact Finish - Post | Gold |
Contact Finish Thickness - Mating | 30µin (0.76µm) |
Contact Finish Thickness - Post | 30µin (0.76µm) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Contact Resistance | 30 mOhm |
Current Rating | - |
Datasheets | 1825093 |
Family | Sockets for ICs, Transistors |
Features | Open Frame |
Housing Material | Thermoplastic, Glass Filled |
Material Flammability Rating | UL94 V-0 |
Mounting Type | Through Hole |
Number of Positions or Pins (Grid) | 16 (2 x 8) |
Operating Temperature | -55°C ~ 125°C |
Packaging | Tube |
Pitch - Mating | 0.100" (2.54mm) |
Pitch - Post | 0.100" (2.54mm) |
Product Photos | 1-1825093-4, 1825093-4 |
RoHS Information | 1-1825093-4 Statement of Compliance RoHS 2 Statement |
Series | Diplomate DL |
Standard Package | 2,600 |
Termination | Solder |
Termination Post Length | 0.128" (3.24mm) |
Type | DIP, 0.3" (7.62mm) Row Spacing |