K9F5616U0C-HCB00
16M X 16 FLASH 2.7V PROM, 30 ns, PBGA63

From Samsung Semiconductor Division

StatusACTIVE
Access Time-Max (tACC)30 ns
Lead FreeYes
Memory Density2.68E8 deg
Memory IC TypeFLASH 2.7V PROM
Memory Width16
Mfr Package Description9 X 11 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TBGA-63
Number of Functions1
Number of Terminals63
Number of Words1.68E7 words
Number of Words Code16M
Operating ModeASYNCHRONOUS
Operating Temperature-Max70 Cel
Operating Temperature-Min0.0 Cel
Organization16M X 16
Package Body MaterialPLASTIC/EPOXY
Package ShapeRECTANGULAR
Package StyleGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)3.6 V
Supply Voltage-Min (Vsup)2.7 V
Supply Voltage-Nom (Vsup)3.3 V
Surface MountYes
TechnologyCMOS
Temperature GradeCOMMERCIAL
Terminal FinishNOT SPECIFIED
Terminal FormBALL
Terminal Pitch0.8000 mm
Terminal PositionBOTTOM

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