K4D26323QV-VC330
4M X 32 DDR DRAM, 0.55 ns, PBGA144

From Samsung Semiconductor Division

StatusACTIVE
Access ModeFOUR BANK PAGE BURST
Access Time-Max (tRAC)0.5500 ns
Lead FreeYes
Memory Density1.34E8 deg
Memory IC TypeDDR DRAM
Memory Width32
Mfr Package DescriptionLEAD FREE, FBGA-144
Number of Functions1
Number of Ports1
Number of Terminals144
Number of Words4.19E6 words
Number of Words Code4M
Operating ModeSYNCHRONOUS
Operating Temperature-Max65 Cel
Operating Temperature-Min0.0 Cel
Organization4M X 32
Package Body MaterialPLASTIC/EPOXY
Package ShapeSQUARE
Package StyleGRID ARRAY, LOW PROFILE, FINE PITCH
Supply Voltage-Max (Vsup)2.1 V
Supply Voltage-Min (Vsup)1.9 V
Supply Voltage-Nom (Vsup)2 V
Surface MountYes
TechnologyCMOS
Temperature GradeCOMMERCIAL
Terminal FormBALL
Terminal Pitch0.8000 mm
Terminal PositionBOTTOM

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