Product Datasheet Search Results:
9 Pages, 326 KB, Original- SIGC158T120R3EX1SA6
- Infineon Technologies Ag
- Trans IGBT Chip N-CH 1200V 3-Pin Die Wafer
Product Details Search Results:
Infineon.com/SIGC158T120R3EX1SA6
{"Operating Temperature (Min)":"-55C","Mounting":"Not Required","Operating Temperature (Max)":"175C","Gate to Emitter Voltage (Max)":"\u00b120(V)","Channel Type":"N","Packaging":"Wafer","Operating Temperature Classification":"Military","Rad Hardened":"No","Package Type":"Die","Configuration":"Single","Pin Count":"3"}...
1487 Bytes - 17:48:07, 30 November 2024
Documentation and Support
Use our online request for specific proposed solutions or send your technical question directly to a product specialist at request:
| File Name | File Size (MB) | Document | MOQ | Support |
|---|---|---|---|---|
| LUMACELL_SIGNATURE_SURFACE_DESIGNER_CATSHEET.pdf | 0.16 | 1 | Request | |
| SIGNAL_DESCRIPTION_ARC_WELDING_PRODUCTS_IRC5_DESIGN_2006.pdf | 0.83 | 1 | Request | |
| INSTRUCTION_FEX631_FET632_RETROFIT_CONVERSION_CONFIGURATION_PARAMETERIZATION_INSTRUCTION_FOR_FXE_FXM_FEP300_FEP500_REMOTE_MOUNT_DESIGN_AND_INTEGRAL_MOUNT_DESIGN.pdf | 8.47 | 1 | Request | |
| DATA_SHEET_TEIP11_PS_I_P_SIGNAL_CONVERTER_FOR_STANDARD_SIGNALS_WITH_POWER_STAGE.pdf | 1.16 | 1 | Request | |
| SYSTEM_PLUS_SYSTEM_2N_ELECTRICAL_DISTRIBUTION_DATA_CENTER_DESIGN_IEC_0_5_MW_IT_LOAD_DESIGN.pdf | 1.80 | 1 | Request | |
| DATA_SHEET_TEIP11_I_P_SIGNAL_CONVERTER_FOR_STANDARD_SIGNALS.pdf | 0.89 | 1 | Request | |
| MISSION_PEAK_NGSFF_ALL_FLASH_NVME_REFERENCE_DESIGN.pdf | 1.18 | 1 | Request | |
| ATC_DESIGN_KITS.pdf | 1.16 | 1 | Request | |
| DESIGN_KITS_CATALOG.pdf | 1.10 | 1 | Request | |
| US2:SND6B800LSIGH.pdf | 0.64 | 1 | Request | |
| US2:SCMD6B600LSIG.pdf | 0.64 | 1 | Request | |
| US2:SMD6B700LSIG.pdf | 0.64 | 1 | Request |
