WS1M32V-17G3M 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP84
From Microsemi Corp.
Status | ACTIVE |
Access Time-Max (tACC) | 17 ns |
Memory Density | 3.36E7 deg |
Memory IC Type | MULTI DEVICE SRAM MODULE |
Memory Width | 32 |
Mfr Package Description | 28 MM, CERAMIC, QFP-84 |
Number of Functions | 1 |
Number of Terminals | 84 |
Number of Words | 1.05E6 words |
Number of Words Code | 1M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 125 Cel |
Operating Temperature-Min | -55 Cel |
Organization | 1M X 32 |
Package Body Material | CERAMIC, METAL-SEALED COFIRED |
Package Shape | RECTANGULAR |
Package Style | FLATPACK |
Parallel/Serial | PARALLEL |
Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 3 V |
Supply Voltage-Nom (Vsup) | 3.3 V |
Surface Mount | Yes |
Technology | CMOS |
Temperature Grade | MILITARY |
Terminal Finish | GOLD |
Terminal Form | GULL WING |
Terminal Position | QUAD |