WF1M32B-100G2UM3
1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CQFP68

From Microsemi Corp.

StatusACTIVE
Access Time-Max (tACC)100 ns
Memory Density3.36E7 deg
Memory IC TypeFLASH 3.3V PROM MODULE
Memory Width32
Mfr Package Description0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68
Number of Functions1
Number of Terminals68
Number of Words1.05E6 words
Number of Words Code1M
Operating ModeASYNCHRONOUS
Operating Temperature-Max125 Cel
Operating Temperature-Min-55 Cel
Organization1M X 32
Package Body MaterialCERAMIC, METAL-SEALED COFIRED
Package ShapeSQUARE
Package StyleFLATPACK
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)3.6 V
Supply Voltage-Min (Vsup)3 V
Supply Voltage-Nom (Vsup)3.3 V
Surface MountYes
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishGOLD
Terminal FormGULL WING
Terminal Pitch1.27 mm
Terminal PositionQUAD

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