W78M64VP110SBM 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159
From Microsemi Corp.
| Status | ACTIVE |
| Access Time-Max (tACC) | 110 ns |
| Alternate Memory Width | 32 |
| Memory Density | 5.37E8 deg |
| Memory IC Type | FLASH 3.3V PROM |
| Memory Width | 64 |
| Mfr Package Description | 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |
| Number of Functions | 1 |
| Number of Terminals | 159 |
| Number of Words | 8.39E6 words |
| Number of Words Code | 8M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 125 Cel |
| Operating Temperature-Min | -55 Cel |
| Organization | 8M X 64 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 3 V |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Surface Mount | Yes |
| Technology | CMOS |
| Temperature Grade | MILITARY |
| Terminal Form | BALL |
| Terminal Pitch | 1.27 mm |
| Terminal Position | BOTTOM |
