5962-9461110H9X
512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQMA68

From Microsemi Corp.

StatusACTIVE
Access Time-Max (tACC)17 ns
Alternate Memory Width16
Memory Density1.68E7 deg
Memory IC TypeMULTI DEVICE SRAM MODULE
Memory Width32
Mfr Package Description23.90 X 23.90 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, LQFP-68
Number of Functions1
Number of Terminals68
Number of Words524288 words
Number of Words Code512K
Operating ModeASYNCHRONOUS
Operating Temperature-Max125 Cel
Operating Temperature-Min-55 Cel
Organization512K X 32
Package Body MaterialCERAMIC, METAL-SEALED COFIRED
Package ShapeSQUARE
Package StyleMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)5.5 V
Supply Voltage-Min (Vsup)4.5 V
Supply Voltage-Nom (Vsup)5 V
Surface MountYes
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishGOLD
Terminal FormGULL WING
Terminal PositionQUAD

External links