DS34T108GN+
IC TDM OVER PACKET 484HSBGA

From Maxim Integrated

ApplicationsData Transport
CategoryIntegrated Circuits (ICs)
DatasheetsDS34T101,102,104,108
FamilySpecialized ICs
Mounting TypeSurface Mount
Package / Case484-BGA Exposed Pad
PackagingTray
Product Photos484-BGA Exp Pad
Product Training ModulesLead (SnPb) Finish for COTS Long-Term Supply Program
Series-
Standard Package30
Supplier Device Package484-HSBGA (23x23)
TypeTDM (Time Division Multiplexing)

External links