Product Datasheet Search Results:
- MCP6022
- Microchip Technology
- Rail-to-Rail Input-Output, 10Mhz OP Amps
- MCP6022-E/P
- Microchip Technology
- IC OPAMP DUAL 2.5V 10MHZ 8DIP - MCP6022-E/P
- MCP6022-E/SL
- Microchip Technology
- Rail-to-Rail Input/Output, 10 MHz Op Amps
- MCP6022-E/SN
- Microchip Technology
- IC OPAMP DUAL 2.5V 10MHZ 8SOIC - MCP6022-E/SN
- MCP6022-E/ST
- Microchip Technology
- IC OPAMP DUAL 2.5V 10MHZ 8-TSSOP - MCP6022-E/ST
- MCP6022-I/P
- Microchip Technology
- IC OPAMP 2.5V DUAL R-R 8DIP - MCP6022-I/P
- MCP6022-I/PREL
- Microchip Technology, Inc.
- DUAL OP-AMP, 500 uV OFFSET-MAX, 10 MHz BAND WIDTH, PDIP8
- MCP6022-I/SL
- Microchip Technology
- Rail-to-Rail Input/Output, 10 MHz Op Amps
- MCP6022-I/SN
- Microchip Technology
- IC OPAMP 2.5V DUAL R-R 8SOIC - MCP6022-I/SN
- MCP6022-I/ST
- Microchip Technology
- IC OPAMP 2.5V DUAL R-R 8TSSOP - MCP6022-I/ST
- MCP6022-I/STG
- Microchip Technology
- Dual 2.3V 10 MHz OP, -40C to +85C, 8-TSSOP, TUBE
- MCP6022T-E/P
- Microchip Technology
- Rail-to-Rail Input/Output, 10 MHz Op Amps
Product Details Search Results:
Microchip.com/MCP6022-E/P
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 125\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-DIP (0.300\", 7.62mm)","Current - Input Bias":"1pA","Product Photos":"8-DIP","PCN Assembly/Origin":"Qualification Revision 23/Aug/2013 Qualification SPDIP-28L, PDIP-8/16L 18/Sep/2013 Qualification Revision 18/Dec/2013 Qualification Revision 06/Feb/2014 Qualification Copper Wire 17/Mar/2014 Qualification Copper Bond Wire 17...
2212 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022-E/SN
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 125\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-SOIC (0.154\", 3.90mm Width)","Current - Input Bias":"1pA","Product Photos":"8-SOIC","PCN Assembly/Origin":"SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015","PCN Design/Specification":"SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/20...
2548 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022-E/ST
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 125\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-TSSOP (0.173\", 4.40mm Width)","Current - Input Bias":"1pA","Product Photos":"8-SOIC","PCN Assembly/Origin":"Copper Bond Wire Qualification 09/Sep/2014","Output Type":"Rail-to-Rail","Datasheets":"MCP6021/1R/2/3/4 Development Tools Catalog","Current - Supply":"1mA","Standard Package":"100","Current - Output / Channel":"30mA...
2035 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022-I/P
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-DIP (0.300\", 7.62mm)","Current - Input Bias":"1pA","Product Photos":"8-DIP","PCN Assembly/Origin":"Qualification Revision 23/Aug/2013 Qualification SPDIP-28L, PDIP-8/16L 18/Sep/2013 Qualification Revision 18/Dec/2013 Qualification Revision 06/Feb/2014 Qualification Copper Wire 17/Mar/2014 Qualification Copper Bond Wire 17/...
2223 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022-I/PREL
{"Terminal Pitch":"2.54 mm","Terminal Form":"THROUGH-HOLE","Operating Temperature-Max":"85 Cel","Supply Voltage-Nom (Vsup)":"5 V","Temperature Grade":"INDUSTRIAL","Package Shape":"RECTANGULAR","Status":"ACTIVE","Operating Temperature-Min":"-40 Cel","Input Offset Voltage-Max":"500 mV","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"2","Slew Rate-Nom":"7 V/us","Bandwidth-Nom":"10 kHz","Supply Voltage Limit-Max":"7 V","Average Bias Current-Max (IIB)":"1.50E-4 uA","Common-mode Reject Ratio-Nom":"...
1489 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022-I/SN
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-SOIC (0.154\", 3.90mm Width)","Current - Input Bias":"1pA","Product Photos":"8-SOIC","PCN Assembly/Origin":"SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015","PCN Design/Specification":"SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/201...
2560 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022-I/ST
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-TSSOP (0.173\", 4.40mm Width)","Current - Input Bias":"1pA","Product Photos":"8-SOIC","PCN Assembly/Origin":"Copper Bond Wire Qualification 09/Sep/2014","Output Type":"Rail-to-Rail","Datasheets":"MCP6021/1R/2/3/4 Development Tools Catalog","Current - Supply":"1mA","Standard Package":"100","Current - Output / Channel":"30mA"...
2300 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022T-E/SN
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 125\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-SOIC (0.154\", 3.90mm Width)","Current - Input Bias":"1pA","Product Photos":"8-SOIC","PCN Assembly/Origin":"SOIC-8L Copper Bond Wire Revision 06/Feb/2014","PCN Design/Specification":"SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/2013 Multiple Devices Datasheet Update 18/Aug/2014","Output Type":"Rail-...
2196 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022T-E/ST
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 125\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-TSSOP (0.173\", 4.40mm Width)","Current - Input Bias":"1pA","Product Photos":"8-SOIC","PCN Assembly/Origin":"Copper Bond Wire Qualification 09/Sep/2014","Output Type":"Rail-to-Rail","Datasheets":"MCP6021/1R/2/3/4 Development Tools Catalog","Current - Supply":"1mA","Standard Package":"2,500","Current - Output / Channel":"30...
1949 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022T-I/P
{"Terminal Finish":"MATTE TIN","Terminal Pitch":"2.54 mm","Terminal Form":"THROUGH-HOLE","Operating Temperature-Max":"85 Cel","Supply Voltage-Nom (Vsup)":"5 V","Temperature Grade":"INDUSTRIAL","Package Shape":"RECTANGULAR","Status":"ACTIVE","Lead Free":"Yes","Operating Temperature-Min":"-40 Cel","Input Offset Voltage-Max":"500 mV","Package Body Material":"PLASTIC/EPOXY","Number of Functions":"2","Slew Rate-Nom":"7 V/us","Bandwidth-Nom":"10 kHz","EU RoHS Compliant":"Yes","Supply Voltage Limit-Max":"7 V","Chi...
1543 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022T-I/SN
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-SOIC (0.154\", 3.90mm Width)","Current - Input Bias":"1pA","Product Photos":"8-SOIC","PCN Assembly/Origin":"SOIC-8L Copper Bond Wire Revision 06/Feb/2014 Assembly Site Addition 08/Apr/2015 Assembly Site Addition 08/Apr/2015","PCN Design/Specification":"SOIC-8L Copper Bond Wire 18/Sep/2013 SOIC-8L Copper Bond Wire 18/Dec/201...
2630 Bytes - 07:17:48, 01 December 2024
Microchip.com/MCP6022T-I/ST
{"Category":"Integrated Circuits (ICs)","-3db Bandwidth":"-","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Voltage - Supply, Single/Dual (\u00b1)":"2.5 V ~ 5.5 V","Package / Case":"8-TSSOP (0.173\", 4.40mm Width)","Current - Input Bias":"1pA","Product Photos":"8-SOIC","PCN Assembly/Origin":"Copper Bond Wire Qualification 09/Sep/2014","Output Type":"Rail-to-Rail","Datasheets":"MCP6021/1R/2/3/4 Development Tools Catalog","Current - Supply":"1mA","PCN Packaging":"Reel Design Update 07/May/2015","Current - ...
2369 Bytes - 07:17:48, 01 December 2024
Documentation and Support
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