RD28F3208W30T70 SPECIALTY MEMORY CIRCUIT, PBGA80
From Intel Corporation
Status | DISCONTINUED |
Memory Density | 3.36E7 deg |
Memory IC Type | MEMORY CIRCUIT |
Memory Width | 16 |
Mfr Package Description | 14 X 8 MM, 0.80 MM PITCH, STACK, CSP-80 |
Number of Functions | 1 |
Number of Terminals | 80 |
Number of Words | 2.10E6 words |
Number of Words Code | 2M |
Operating Mode | SYNCHRONOUS |
Operating Temperature-Max | 85 Cel |
Operating Temperature-Min | -25 Cel |
Organization | 2M X 16 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
Supply Voltage-Max (Vsup) | 1.9 V |
Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V |
Surface Mount | Yes |
Temperature Grade | OTHER |
Terminal Finish | TIN LEAD |
Terminal Form | BALL |
Terminal Pitch | 0.8000 mm |
Terminal Position | BOTTOM |