RD28F1602C3B70 SPECIALTY MEMORY CIRCUIT, PBGA66
From Intel Corporation
| Status | ACTIVE |
| Memory Density | 1.68E7 deg |
| Memory IC Type | MEMORY CIRCUIT |
| Memory Width | 16 |
| Mfr Package Description | 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66 |
| Number of Functions | 1 |
| Number of Terminals | 66 |
| Number of Words | 1.05E6 words |
| Number of Words Code | 1M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 85 Cel |
| Operating Temperature-Min | -25 Cel |
| Organization | 1M X 16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Supply Voltage-Max (Vsup) | 3.3 V |
| Supply Voltage-Min (Vsup) | 2.7 V |
| Supply Voltage-Nom (Vsup) | 3 V |
| Surface Mount | Yes |
| Temperature Grade | COMMERCIAL EXTENDED |
| Terminal Finish | NOT SPECIFIED |
| Terminal Form | BALL |
| Terminal Pitch | 0.8000 mm |
| Terminal Position | BOTTOM |
