72V03L35JG8 2K X 9 OTHER FIFO, 35 ns, PQCC32
From Integrated Device Technology
| Status | ACTIVE |
| Access Time-Max (tACC) | 35 ns |
| Cycle Time | 45 ns |
| EU RoHS Compliant | Yes |
| Lead Free | Yes |
| Memory Density | 18432 deg |
| Memory IC Type | OTHER FIFO |
| Memory Width | 9 |
| Mfr Package Description | PLASTIC, LCC-32 |
| Number of Functions | 1 |
| Number of Terminals | 32 |
| Number of Words | 2048 words |
| Number of Words Code | 2K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 70 Cel |
| Operating Temperature-Min | 0.0 Cel |
| Organization | 2K X 9 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | CHIP CARRIER |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 3 V |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Surface Mount | Yes |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | MATTE TIN |
| Terminal Form | J BEND |
| Terminal Pitch | 1.27 mm |
| Terminal Position | QUAD |
