HY27UG162G5A-FPCS 128M X 16 FLASH 3.3V PROM, 20 ns, PBGA63
From SK Hynix
Status | DISCONTINUED |
Access Time-Max (tACC) | 20 ns |
China RoHS Compliant | Yes |
EU RoHS Compliant | Yes |
Lead Free | Yes |
Memory Density | 2.05E9 deg |
Memory IC Type | FLASH 3.3V PROM |
Memory Width | 16 |
Mfr Package Description | 9 X 11 MM, 0.86 MM HEIGHT, FBGA-63 |
Number of Functions | 1 |
Number of Terminals | 63 |
Number of Words | 1.28E8 words |
Number of Words Code | 128M |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 70 Cel |
Operating Temperature-Min | 0.0 Cel |
Organization | 128M X 16 |
Package Body Material | PLASTIC/EPOXY |
Package Shape | RECTANGULAR |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Supply Voltage-Max (Vsup) | 3.6 V |
Supply Voltage-Min (Vsup) | 2.7 V |
Supply Voltage-Nom (Vsup) | 3.3 V |
Surface Mount | Yes |
Temperature Grade | COMMERCIAL |
Terminal Finish | TIN SILVER COPPER |
Terminal Form | BALL |
Terminal Pitch | 0.8000 mm |
Terminal Position | BOTTOM |