HY27UG162G5A-FCP 128M X 16 FLASH 3.3V PROM, 20 ns, PBGA63
From SK Hynix
| Status | DISCONTINUED |
| Access Time-Max (tACC) | 20 ns |
| China RoHS Compliant | Yes |
| EU RoHS Compliant | Yes |
| Lead Free | Yes |
| Memory Density | 2.05E9 deg |
| Memory IC Type | FLASH 3.3V PROM |
| Memory Width | 16 |
| Mfr Package Description | 9 X 11 MM, 0.86 MM HEIGHT, FBGA-63 |
| Number of Functions | 1 |
| Number of Terminals | 63 |
| Number of Words | 1.28E8 words |
| Number of Words Code | 128M |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 70 Cel |
| Operating Temperature-Min | 0.0 Cel |
| Organization | 128M X 16 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 2.7 V |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Surface Mount | Yes |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.8000 mm |
| Terminal Position | BOTTOM |
