HY27UF081G2A-FPCP
128M X 8 FLASH 3.3V PROM, 25000 ns, PBGA63

From SK Hynix

StatusDISCONTINUED
Access Time-Max (tACC)25000 ns
China RoHS CompliantYes
EU RoHS CompliantYes
Lead FreeYes
Memory Density1.02E9 deg
Memory IC TypeFLASH 3.3V PROM
Memory Width8
Mfr Package Description9 X 11 MM, 0.80 MM PICTH, LEAD FREE, FBGA-63
Number of Functions1
Number of Terminals63
Number of Words1.28E8 words
Number of Words Code128M
Operating ModeASYNCHRONOUS
Operating Temperature-Max70 Cel
Operating Temperature-Min0.0 Cel
Organization128M X 8
Package Body MaterialPLASTIC/EPOXY
Package ShapeRECTANGULAR
Package StyleGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)3.6 V
Supply Voltage-Min (Vsup)2.7 V
Supply Voltage-Nom (Vsup)3.3 V
Surface MountYes
Temperature GradeCOMMERCIAL
Terminal FinishTIN SILVER COPPER
Terminal FormBALL
Terminal Pitch0.8000 mm
Terminal PositionBOTTOM

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