HX84050BHC
128K X 40 MULTI DEVICE SRAM MODULE, 30 ns, CQFP200

From Honeywell - Microelectronics & Precision Sensors

StatusACTIVE
Access Time-Max (tACC)30 ns
Memory Density5.24E6 deg
Memory IC TypeMULTI DEVICE SRAM MODULE
Memory Width40
Mfr Package Description2.100 X 2.100 INCH, CERAMIC, QFP-200
Number of Functions1
Number of Terminals200
Number of Words131072 words
Number of Words Code128K
Operating ModeASYNCHRONOUS
Operating Temperature-Max125 Cel
Operating Temperature-Min-55 Cel
Organization128K X 40
Package Body MaterialCERAMIC, METAL-SEALED COFIRED
Package ShapeSQUARE
Package StyleFLATPACK, GUARD RING
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)5.5 V
Supply Voltage-Min (Vsup)4.5 V
Supply Voltage-Nom (Vsup)5 V
Surface MountYes
TechnologyCMOS
Temperature GradeMILITARY
Terminal FormFLAT
Terminal Pitch0.9000 mm
Terminal PositionQUAD

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