SF-1206HI250M-2 Fuse Chip 2.5A 32V SMD Solder Pad 1206 Ceramic T/R
From BOURNS
| Current Rating | 2.5(A) |
| Fuse Size | 3.2 X 1.6 X 0.97 |
| Housing Material | Ceramic |
| Mounting | Surface Mount |
| Operating Temp Range | -55C to 150C |
| Operating Temperature Classification | Military |
| Packaging | Tape and Reel |
| Pin Count | 2 |
| Product Depth (mm) | 1.6(mm) |
| Product Diameter (mm) | Not Required(mm) |
| Product Height (mm) | 0.97(mm) |
| Product Length (mm) | 3.2(mm) |
| Rad Hardened | No |
| Seated Plane Height | Not Required(mm) |
| Terminal Pitch (mm) | Not Required(mm) |
| Termination Style | SOLDER PAD |
| Type | Chip |
| Voltage Rating | 32 |
| Voltage Rating (VDC) | 32(V) |
