5962F-0422701QXA 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
From Aeroflex Incorporated
Status | ACTIVE |
Access Time-Max (tACC) | 17 ns |
Memory Density | 1.68E7 deg |
Memory IC Type | MULTI DEVICE SRAM MODULE |
Memory Width | 32 |
Mfr Package Description | CERAMIC, QFP-68 |
Number of Functions | 1 |
Number of Terminals | 68 |
Number of Words | 524288 words |
Number of Words Code | 512K |
Operating Mode | ASYNCHRONOUS |
Operating Temperature-Max | 125 Cel |
Operating Temperature-Min | -55 Cel |
Organization | 512K X 32 |
Package Body Material | CERAMIC, METAL-SEALED COFIRED |
Package Shape | RECTANGULAR |
Package Style | FLATPACK, GUARD RING |
Parallel/Serial | PARALLEL |
Supply Voltage-Max (Vsup) | 1.9 V |
Supply Voltage-Min (Vsup) | 1.7 V |
Supply Voltage-Nom (Vsup) | 1.8 V |
Surface Mount | Yes |
Technology | CMOS |
Temperature Grade | MILITARY |
Terminal Finish | TIN LEAD |
Terminal Form | FLAT |
Terminal Pitch | 1.27 mm |
Terminal Position | QUAD |