5962D-0153302VYC 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
From Aeroflex / Colorado Springs
| Status | ACTIVE |
| Access Time-Max (tACC) | 25 ns |
| Memory Density | 1.68E7 deg |
| Memory IC Type | MULTI DEVICE SRAM MODULE |
| Memory Width | 32 |
| Mfr Package Description | CERAMIC, QFP-68 |
| Number of Functions | 1 |
| Number of Terminals | 68 |
| Number of Words | 524288 words |
| Number of Words Code | 512K |
| Operating Mode | ASYNCHRONOUS |
| Operating Temperature-Max | 105 Cel |
| Operating Temperature-Min | -40 Cel |
| Organization | 512K X 32 |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED |
| Package Shape | SQUARE |
| Package Style | FLATPACK, GUARD RING |
| Parallel/Serial | PARALLEL |
| Supply Voltage-Max (Vsup) | 3.6 V |
| Supply Voltage-Min (Vsup) | 3 V |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Surface Mount | Yes |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | GOLD OVER NICKEL |
| Terminal Form | FLAT |
| Terminal Pitch | 1.27 mm |
| Terminal Position | QUAD |
