{"Category":"Integrated Circuits (ICs)","Number of Inputs":"3","PCN Design\/Specification":"Die Material, Mold Compound 03\/Oct\/2008 Marking Content 19\/Nov\/2013","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Package \/ Case":"6-UFDFN","Product Photos":"6-TSOP","Current - Quiescent (Max)":"2\u00b5A","Datasheets":"NC7SZ10","Max Propagation Delay @ V, Max CL":"7.5ns @ 5V, 50pF","Standard Package":"1","Number of Circuits":"1","Logic Level - High":"-","Features":"-","Family":"Logic - Gates and Inverters",...

{"Number of Inputs":"3-IN","Mounting":"Surface Mount","Logic Family":"TinyLogic UHS","High Level Output Current":"-32(mA)","Operating Temperature Classification":"Industrial","Package Type":"MicroPak W","Operating Supply Voltage (Max)":"5.5(V)","Propagation Delay Time":"8.5@3.3V\/7.5@5V(ns)","Quiescent Current":"2(uA)","Number of Outputs":"1","Number of Output Enables per Element":"0","Logical Function":"NAND","Operating Supply Voltage (Min)":"1.65(V)","Low Level Output Current":"32(mA)","Operating Temp Ran...